component-by-component reflow

component-by-component reflow
пайка расплавлением дозированного припоя по схеме "компонент за компонентом"

English-Russian electronics dictionary .

Смотреть что такое "component-by-component reflow" в других словарях:

  • Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… …   Wikipedia

  • Reflow — may refer to:* Reflow soldering, the most common means to attach a surface mounted component to a circuit board. * HTML Reflow, the process by which the geometry of the layout engine s formatting objects are computed …   Wikipedia

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Automated optical inspection — (AOI) is an automated visual inspection of a wide range of products, such as printed circuit boards (PCBs), LCDs, transistors, automotive parts, lids and labels on product packages or agricultural products (seed corn or fruits). In case of PCB… …   Wikipedia

  • Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …   Wikipedia

  • Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

  • Mobile operating system — A mobile operating system, also known as a mobile OS, mobile software platform or a handheld operating system, is the operating system that controls a mobile device or information appliance similar in principle to an operating system such as… …   Wikipedia

  • Moisture Sensitivity Level — relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (approximately 30°C/60%RH).… …   Wikipedia

  • ECONOMIC AFFAIRS — THE PRE MANDATE (LATE OTTOMAN) PERIOD Geography and Borders In September 1923 a new political entity was formally recognized by the international community. Palestine, or Ereẓ Israel as Jews have continued to refer to it for 2,000 years,… …   Encyclopedia of Judaism

  • Thermal management of electronic devices and systems — Heat generated by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Techniques for heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such… …   Wikipedia

  • Heat sink — A heat sink (or heatsink) is an environment or object that absorbs and dissipates heat from another object using thermal contact (either direct or radiant). Heat sinks are used in a wide range of applications wherever efficient heat dissipation… …   Wikipedia


Поделиться ссылкой на выделенное

Прямая ссылка:
Нажмите правой клавишей мыши и выберите «Копировать ссылку»